Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure
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چکیده
alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure Jeffrey C. K. Lam, Maggie Y. M. Huang, Tsu Hau Ng, Mohammed Khalid Bin Dawood, Fan Zhang, Anyan Du, Handong Sun, Zexiang Shen, and Zhihong Mai GLOBALFOUNDRIES Singapore Pte Ltd, Woodlands Industrial Park D, Street 2, Singapore 738406 Division of Physics and Applied Physics, School of Physical and Mathematical Sciences, Nanyang Technological University, Singapore 637371
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